{"id":2143,"date":"2026-09-14T16:56:23","date_gmt":"2026-09-14T14:56:23","guid":{"rendered":"https:\/\/www.sct-ceramics.com\/?page_id=2143"},"modified":"2026-10-30T12:04:33","modified_gmt":"2026-10-30T11:04:33","slug":"cermet-technology","status":"publish","type":"page","link":"https:\/\/www.sct-ceramics.com\/en\/products\/cermet-technology\/","title":{"rendered":"CerMet Technology"},"content":{"rendered":"\n
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A Platform for High-Density Ceramic Interconnection<\/h2>\n\n\n\n

Push the limits of miniaturization, channel density, and functional integration.<\/p>\n\n\n\n

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  • Up to 800 channels\/cm\u00b2<\/li>\n\n\n\n
  • Pitch down to 300 \u00b5m<\/li>\n\n\n\n
  • Biocompatible alumina-platinum HTCC platform<\/li>\n\n\n\n
  • Excellent via conductivity<\/li>\n\n\n\n
  • Conductive network integrated within the multilayer ceramic structure<\/li>\n\n\n\n
  • Internal routing for greater design flexibility<\/li>\n\n\n\n
  • Integrated antennas for wireless communication and inductive charging<\/li>\n<\/ul>\n<\/div>\n\n\n\n
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    Need a Hundred Channels\u2014or Just a Few?<\/h2>\n\n\n\n

    CerMet offers exceptional design flexibility, accommodating a wide range of interconnection requirements\u2014from just a few connections to several hundred channels within a single component.<\/p>\n\n\n\n

    With vias integrated directly into the ceramic, CerMet enables tighter<\/strong> pitch and<\/strong> very<\/strong> high<\/strong> densities<\/strong> while minimizing the overall component footprint.<\/p>\n\n\n\n

    This flexibility allows the CerMet architecture to be tailored to each device, whether the goal is to miniaturize<\/strong> a<\/strong> small<\/strong> <\/strong>number<\/strong> of connections or<\/strong> integrate<\/strong> <\/strong>hundreds<\/strong> of channels<\/strong> into<\/strong> an<\/strong> extremely<\/strong> compact<\/strong> footprint<\/strong>.<\/strong><\/p>\n<\/div>\n<\/div>\n<\/section>\n\n\n\n

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    What Is CerMet?<\/h2>\n<\/div>\n\n\n\n
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    CerMet is more than a hermetic feedthrough. It is a fully integrated ceramic interconnection platform.<\/p>\n<\/div>\n<\/div>\n\n\n\n

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    A proprietary alumina-platinum conductive paste is screen-printed between multiple ceramic layers before co-firing, creating a continuous conductive network embedded directly within the ceramic structure.<\/p>\n\n\n\n

    The result is a fundamentally different approach to ceramic interconnection, combining very<\/strong> high<\/strong> interconnection<\/strong> density<\/strong> with<\/strong> the<\/strong> biocompatibility,<\/strong> hermeticity<\/strong> and<\/strong> reliability<\/strong> required<\/strong> for<\/strong> next-generation<\/strong> implantable<\/strong> medical<\/strong> devices.<\/strong><\/p>\n<\/div>\n\n\n\n

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    La structure imbriqu\u00e9e du platine et de la c\u00e9ramique permet d\u2019obtenir une \u00e9tanch\u00e9it\u00e9 herm\u00e9tique.<\/figcaption><\/figure>\n\n\n\n
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    Why is CerMet different?<\/h2>\n<\/div>\n\n\n\n
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    Integrated conductive network & internal routing<\/h3>\n\n\n\n

    Conductive paths are integrated directly within the multilayer ceramic structure, enabling complex internal routing and greater design flexibility.<\/p>\n<\/div>\n<\/div>\n\n\n\n

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    Ultra-high density<\/h3>\n\n\n\n

    Pitch down to 300 \u00b5m<\/strong> and up to 800 channels\/cm\u00b2<\/strong>, with excellent via conductivity and high electrical insulation between adjacent conductors.<\/p>\n<\/div>\n<\/div>\n\n\n\n

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    Miniaturization<\/h3>\n\n\n\n

    Higher interconnection density reduces the overall footprint of implantable devices without compromising functionality.<\/p>\n<\/div>\n<\/div>\n<\/div>\n\n\n\n

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    Integrated antenneas<\/h3>\n\n\n\n

    Antennas can be integrated directly within the multilayer ceramic structure for wireless communication and inductive charging, eliminating the need for separate components.<\/p>\n<\/div>\n<\/div>\n\n\n\n

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    Optimized hermiticity<\/h3>\n\n\n\n

    A single ceramic-to-metal brazed interface simplifies the overall assembly while providing robust, reliable long-term hermeticity<\/p>\n<\/div>\n<\/div>\n\n\n\n

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    Biocompatibility<\/h3>\n\n\n\n

    A biocompatible alumina-platinum HTCC platform designed for implantable medical devices and long-term applications.<\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/section>\n\n\n\n

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    Advanced Routing & Functional Integration<\/h2>\n\n\n\n

    One of CerMet\u2019s key advantages is its ability to integrate the conductive network directly within multiple ceramic layers.<\/p>\n\n\n\n

    Connections can be routed vertically through vias and horizontally between layers, allowing connection points to be positioned independently on either side of the component and providing greater<\/strong> design<\/strong> flexibility.<\/strong><\/p>\n\n\n\n

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    Cross-Section of CerMet Internal Routing<\/em><\/figcaption><\/figure>\n<\/div>\n\n\n\n
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    Top view<\/strong><\/p>\n\n\n\n

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    Bottom view<\/strong><\/p>\n\n\n\n

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    This approach enables:<\/h3>\n\n\n\n
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    • Internal signal routing<\/li>\n\n\n\n
    • Multilayer interconnections<\/li>\n\n\n\n
    • Complex interconnection geometries<\/li>\n\n\n\n
    • Non-linear routing<\/li>\n\n\n\n
    • Compact system architectures<\/li>\n<\/ul>\n<\/div>\n<\/div>\n<\/section>\n\n\n\n
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      Integrated Antenna Technology<\/h2>\n\n\n\n

      CerMet technology enables an antenna to be integrated directly within the multilayer alumina structure, rather than added as a separate component. This approach helps reduce<\/strong> the<\/strong> overall<\/strong> <\/strong>footprint<\/strong> and<\/strong> simplify<\/strong> the architecture of the implantable<\/strong> device<\/strong>.<\/strong><\/p>\n\n\n\n

      The integrated antenna can be connected through a metal pin brazed directly onto the component.<\/p>\n\n\n\n

      Integrated antenna \u00b7 Reduced footprint \u00b7 Simplified architecture<\/strong><\/p>\n\n\n\n

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      Designed for Industrialization<\/h2>\n<\/div>\n\n\n\n
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      CerMet is not only an innovative interconnection technology; it also provides a highly repeatable manufacturing platform.<\/p>\n\n\n\n

      By integrating conductive paths directly during the HTCC process, CerMet offers:<\/p>\n<\/div>\n<\/div>\n\n\n\n

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      • Reduced assembly complexity<\/li>\n\n\n\n
      • Fewer individual components<\/li>\n\n\n\n
      • Controlled, repeatable manufacturing<\/li>\n\n\n\n
      • Improved production efficiency<\/li>\n\n\n\n
      • Excellent scalability to higher production volumes<\/li>\n\n\n\n
      • Opportunities for cost optimization in series production<\/li>\n<\/ul>\n\n\n\n

        CerMet was developed not only as a high-density interconnection technology, but also as an industrial platform capable of supporting projects from initial feasibility studies through series<\/strong> production<\/strong><\/p>\n<\/div>\n\n\n\n

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