{"id":1938,"date":"2026-09-14T17:20:27","date_gmt":"2026-09-14T15:20:27","guid":{"rendered":"https:\/\/www.sct-ceramics.com\/?page_id=1938"},"modified":"2026-10-15T15:13:53","modified_gmt":"2026-10-15T13:13:53","slug":"neurostimulation-brain-computer-interfaces","status":"publish","type":"page","link":"https:\/\/www.sct-ceramics.com\/en\/markets\/neurostimulation-brain-computer-interfaces\/","title":{"rendered":"Neurostimulation & Brain-Computer Interfaces"},"content":{"rendered":"\n
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01 – Components<\/p>\n\n\n\n

Ceramic Packaging Solutions for the Next Generation of Neurotechnology<\/h2>\n\n\n\n

Implantable neurotechnology is entering a new era. As therapies expand beyond traditional neuromodulation and brain-computer interfaces (BCIs) move from research to clinical reality, implantable systems are becoming smaller, smarter, and increasingly connected.<\/p>\n\n\n\n

These advances place growing demands on implantable packaging technologies. Higher channel counts, greater miniaturization, wireless functionality, and long-term reliability all require new approaches to ceramic packaging and electrical interconnection.<\/p>\n\n\n\n

SCT partners with established medical device manufacturers, research institutions, and emerging neurotechnology companies to co-develop customized ceramic-to-metal solutions that help bring the next generation of neurotechnology from concept to production.<\/p>\n\n\n\n

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02 – Challenges<\/p>\n\n\n\n

Challenges We Help Solve<\/h2>\n<\/div>\n\n\n\n
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Our ceramic packaging solutions help address the technical challenges associated with next-generation neurotechnology.<\/p>\n<\/div>\n<\/div>\n\n\n\n

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Miniaturization<\/h3>\n\n\n\n

Reducing implant size while integrating increasing levels of functionality.<\/p>\n<\/div>\n<\/div>\n\n\n\n

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High-Density Interconnection<\/h3>\n\n\n\n

Supporting higher channel counts through increasingly compact feedthrough technologies.<\/p>\n<\/div>\n<\/div>\n\n\n\n

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Long-Term Hermeticity<\/h3>\n\n\n\n

Protecting sensitive electronics throughout the lifetime of the implant.<\/p>\n<\/div>\n<\/div>\n<\/div>\n\n\n\n

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Wireless Communication<\/h3>\n\n\n\n

Packaging solutions compatible with RF communication and next-generation implant architectures.<\/p>\n<\/div>\n<\/div>\n\n\n\n

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Biocompatibility<\/h3>\n\n\n\n

Materials selected for long-term implantable medical applications.<\/p>\n<\/div>\n<\/div>\n\n\n\n

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Scalability<\/h3>\n\n\n\n

Supporting the transition from early prototypes to industrial production.<\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/section>\n\n\n\n

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03 – Applications<\/p>\n\n\n\n

Applications<\/h2>\n\n\n\n

SCT supports manufacturers across a wide range of neurotechnology applications.<\/p>\n<\/div>\n\n\n\n

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Deep Brain Stimulation (DBS)<\/h3>\n\n\n\n

Implantable systems for the treatment of movement disorders and neurological diseases.<\/p>\n<\/div>\n\n\n\n

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Spinal Cord Stimulation (SCS)<\/h3>\n\n\n\n

Advanced implantable therapies for chronic pain management.<\/p>\n<\/div>\n\n\n\n

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Peripheral Nerve Stimulation (PNS)<\/h3>\n\n\n\n

Miniaturized implantable devices targeting peripheral nerves.<\/p>\n<\/div>\n<\/div>\n\n\n\n

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Sacral Neuromodulation (SNM)<\/h3>\n\n\n\n

Implantable systems used to treat bladder and bowel dysfunction.<\/p>\n<\/div>\n\n\n\n

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Brain-Computer Interfaces (BCIs)<\/h3>\n\n\n\n

High-density implantable interfaces designed to record and stimulate neural activity.<\/p>\n<\/div>\n\n\n\n

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Closed-Loop Neuromodulation<\/h3>\n\n\n\n

Next-generation systems capable of sensing, interpreting, and adapting therapy in real time.<\/p>\n<\/div>\n<\/div>\n<\/section>\n\n\n\n

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04 – Products<\/p>\n\n\n\n

Typical Products We Develop<\/h2>\n<\/div>\n\n\n\n
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Every solution is co-developed according to the technical and clinical requirements of each implant platform.<\/p>\n<\/div>\n<\/div>\n\n\n\n

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\"Travers\u00e9es<\/figure>
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01<\/p>\n\n\n\n

CerMet\u2122 High-Density Feedthrough Technology<\/h3>\n\n\n\n

Supporting higher channel counts and increasingly compact implant architectures.<\/p>\n<\/div>\n<\/div><\/div>\n<\/div>\n\n\n\n

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\"Travers\u00e9es<\/figure>
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02<\/p>\n\n\n\n

Hermetic Feedthroughs<\/h3>\n\n\n\n

Reliable electrical interconnections for implantable neurotechnology.<\/p>\n<\/div>\n<\/div><\/div>\n<\/div>\n\n\n\n

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\"Bo\u00eetiers<\/figure>
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03<\/p>\n\n\n\n

Ceramic Casings<\/h3>\n\n\n\n

Hermetic packaging solutions supporting miniaturization and wireless communication.<\/p>\n<\/div>\n<\/div><\/div>\n<\/div>\n\n\n\n

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\"Assemblages<\/figure>
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04<\/p>\n\n\n\n

Customized Ceramic-to-Metal Assemblies<\/h3>\n\n\n\n

Engineered packaging solutions for next-generation implantable devices.<\/p>\n<\/div>\n<\/div><\/div>\n<\/div>\n<\/div>\n<\/section>\n\n\n\n

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05 – expertises<\/p>\n\n\n\n

Designed for Next-Generation Neurotechnolog<\/h2>\n\n\n\n

SCT’s Research & Innovation, engineering, and production teams work closely with customers to develop ceramic packaging technologies that support miniaturization, higher channel counts, and robust long-term implant performance. From early feasibility studies to industrial production, we help transform innovative concepts into manufacturable medical devices.<\/p>\n<\/div>\n<\/div>\n\n\n\n

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Our expertise includes:<\/h3>\n\n\n\n